Electronic Components

Mechanical engineering solutions for the production of electronic components such as displays and touch screens, printed circuit boards and semiconductors.

Displays & Touchscreens

With machines and systems in the areas of wet chemistry, automation and laser process technology as well as our integrated inspection systems, we offer highly efficient production processes - for both flexible and rigid substrates in all sizes used in the production of TFT-LCD, OLED, touch sensors and cover glasses.

With our solutions, we are already working with our customers today on the standards of tomorrow. Thanks to our partnership-based cooperation with display manufacturers, we ensure that the complex manufacturing processes run more efficiently, manufacturing costs are reduced and the end products thus become even more affordable.

Printed Circuit Boards

For the production of printed circuit boards and chip carriers, Manz offers wet chemical process technology, for example for exposure or surface treatment. Our portfolio includes both single equipment and fully integrated one-stop solutions for the PCB industry.

With our technologies and service and development centers at our sites in China and Taiwan, we are established as a local partner to the industry and cover almost the entire value chain in the manufacture of printed circuit boards.

The use of innovative production equipment from Manz significantly increases the performance of the production capacities and the printed circuit boards manufactured on them. This gives our customers a significant competitive advantage and enables them to meet the market's ongoing demand for ever lighter, thinner, and better electronic devices.

Semiconductor / FOPLP

Due to the increasing miniaturization in the electronics industry - ever smaller components with ever greater performance - the latest chip packaging process, Fan-Out Panel Level Packaging, plays a decisive role. In addition to significantly reducing the volume, thickness, weight and manufacturing costs of the packaging while doubling the number of pins, the process also has significant positive effects on the thermal conductivity and speed of the components.

For advanced fan-out panel-level packaging (FOPLP), we supply lithography and electroplating equipment that meets the critical process requirements for high-density redistribution layers (RDL). In addition, we meet a wide range of customer requirements with our expertise in laser technology and automation.

We are looking forward to your inquiry!

Contact us