Semiconductor Packaging

With an excellent engineering team for PCB and display production equipment, over 30 years of experience in the industry, and an outstanding sales performance of over 7,500 wet-chemical machines, Manz is able to provide lithography and electroplating equipment for advanced fan-out panel-level packaging (FOPLP) and fulfill the critical process requirements on high-density redistribution layers (RDL). Moreover, Manz is able to satisfy the wide range of customer demands, providing a full array of specialized equipment and technical support including laser technology and automation.

Information and communication technologies continue to develop rapidly. Consumers’ lifestyle will rapidly move from the Internet of Things (IOT) to the Internet of Beings (IOB). These trends call for new semiconductor packaging technologies. Thus, IC design and the level of integration are becoming more and more important.

The semiconductor packaging industry has been actively developing fan-out packaging in recent years, using redistribution layers (RDL) to connect ICs and passive components with different functions to reduce the packaging volume. The new 3D IC that uses vertical integration also changes the way ICs are assembled and connected within a system. These approaches both allow the integration of heterogeneous ICs into a single package while taking into consideration cost and performance.

In the past years, the cost of fan-out wafer-level packaging (FOWLP) could not be reduced significantly. Considering cost saving, the major packaging companies have thus transformed the process technologies of FOWLP to larger square substrates, such as fan-out panel-level packaging (FOPLP) using glass substrates or copper cladded laminates. This lowers cost by increasing area utilization and production capacity. However, these requirements also mean that existing technologies must incorporate new elements in order to break through the existing packaging process architecture to meet the needs of advanced semiconductor packaging.
Manz is going to support this transformation with innovative production solutions: