Inkjet printing technologies play a decisive role in the field of semiconductor IC packaging and offer numerous advantages. With our state-of-the-art printing systems, we enable increased flexibility in your production and significantly improve the environmental friendliness of your system.
Inkjet printing of functional materials - better known as inkjet printing - offers a promising alternative to conventional methods for printing electronics cost-effectively and over large areas.
The maskless process reduces material waste and enables simple modifications through computer-aided design. No expensive lithography or other energy-intensive processes are required.
Our digital inkjet printing technology enables three-dimensional printing of functional materials, including metal structures, produced without exceeding the melting point of bulk metals. We leverage our expertise in TGV metallization and RDL design for semiconductor packaging and perform all steps, from processing to characterization, at low temperatures and in an ambient environment.
We have reached a significant milestone with the establishment of a cutting-edge digital printing laboratory in Taiwan. This facility focuses on advancing semiconductor metallization processes, offering precise solutions across laboratory and industrial production lines.
Our Inkjet printing equipment provides laboratory solutions for validating new functional inks and substrates in semiconductor chip production R&D, with a focus on advanced packaging. Our experienced team and comprehensive resources offer full process development support to help achieve your goals.
Engineered with a single home plug to ensure quick, hassle-free installation and minimal setup.
The smallest system available, offering. a small footprint for space-efficient integration into pilot lines.
Designed with a completely open architecture, enabling maximum flexibility and seamless integration with diverse components and workflows.
Highly adaptable to different processes and applications, providing versatile solutions for diverse needs.
Requires less than 50ml of ink for system startup, ensuring cost-effective & efficient operation.
Simple to replace the curing light module, making maintenance and upgrades quick & easy.
Leverages Manz‘s advanced optical system for self-learning alignment, eliminating the requirement for pre-marked alignment markers and enhancing process efficiency.
Automatically adjusts the table position to maintain optimal alignment & accuracy.
The SDC series provides versatile solutions for both frontend and backend semiconductor processes, supporting wafer and panel substrates with integration to an Inline Measurement System for precision. Key features include Automatic Nozzle Position Calibration, a Heated Processing Stage for flexible development, and full process control to improve yield and stability. The Automatic Waveform Tuning System further optimizes spray parameters, cutting R&D development time from two months to just 30 minutes.