Functional Printing

Inkjet printing technologies play a decisive role in the field of semiconductor IC packaging and offer numerous advantages. With our state-of-the-art printing systems, we enable increased flexibility in your production and significantly improve the environmental friendliness of your system.

Inkjet Printing of Functional Materials

Inkjet printing of functional materials - better known as inkjet printing - offers a promising alternative to conventional methods for printing electronics cost-effectively and over large areas.

The maskless process reduces material waste and enables simple modifications through computer-aided design. No expensive lithography or other energy-intensive processes are required.

 

Redistribution Layer (RDL)

Three-dimensional Printing

Our digital inkjet printing technology enables three-dimensional printing of functional materials, including metal structures, produced without exceeding the melting point of bulk metals. We leverage our expertise in TGV metallization and RDL design for semiconductor packaging and perform all steps, from processing to characterization, at low temperatures and in an ambient environment.

Increased Efficiency with Innovative Inkjet Printing in Semiconductor Metallization Processes

We have reached a significant milestone with the establishment of a cutting-edge digital printing laboratory in Taiwan. This facility focuses on advancing semiconductor metallization processes, offering precise solutions across laboratory and industrial production lines.

Our digital printing lab stands for:

 

  • Progress: Developing cutting-edge digital printing for semiconductor metallization.
  • Precision & Productivity: Ensures superior quality and efficiency for customers.
  • Innovation Leadership: Keeps customers ahead in semiconductor advancements.
  • Excellence: Delivers top-quality metallization solutions.
  • Development: We test new functional printing inks, substrates, and strategies, leveraging our extensive experience and partnerships with ink suppliers to offer accurate field support and real-world training

Innovative Laboratory Equipment

Our Inkjet printing equipment provides laboratory solutions for validating new functional inks and substrates in semiconductor chip production R&D, with a focus on advanced packaging. Our experienced team and comprehensive resources offer full process development support to help achieve your goals.

Simple Plug-and-Play Setup

Engineered with a single home plug to ensure quick, hassle-free installation and minimal setup.

Compact and Space-Saving Design

The smallest system available, offering. a small footprint for space-efficient integration into pilot lines.

Fully Open System

Designed with a completely open architecture, enabling maximum flexibility and seamless integration with diverse components and workflows.

Excellent System Flexibility

Highly adaptable to different processes and applications, providing versatile solutions for diverse needs.

Minimal Ink Consumption

Requires less than 50ml of ink for system startup, ensuring cost-effective & efficient operation.

Easy to Change Post-Treatment Module

Simple to replace the curing light module, making maintenance and upgrades quick & easy.

Self-Learning Alignment Mark System

Leverages Manz‘s advanced optical system for self-learning alignment, eliminating the requirement for pre-marked alignment markers and enhancing process efficiency.

Automatic Table Turning Adjustment

Automatically adjusts the table position to maintain optimal alignment & accuracy.

Equipment for Industrial Production

The SDC series provides versatile solutions for both frontend and backend semiconductor processes, supporting wafer and panel substrates with integration to an Inline Measurement System for precision. Key features include Automatic Nozzle Position Calibration, a Heated Processing Stage for flexible development, and full process control to improve yield and stability. The Automatic Waveform Tuning System further optimizes spray parameters, cutting R&D development time from two months to just 30 minutes.

  • Customization Applications: Tailored for a wide range of needs in semiconductor manufacturing.
  • Precise Printing: Achieves a drop accuracy of ±5 μm @ 3 sigma in the X/Y direction, ensuring excellent dot and space definition.
  • High-Resolution Printing: Supports *.TIFF and DXF file formats with a maximum printing resolution of 5400 dpi via a user-friendly GUI.
  • High-Speed Printing: Capable of printing at 800 mm/sec, with multiple interlaced nozzles for higher resolution and throughput.
  • Self-Calibration: Features precision mechanical design with automatic nozzle calibration for consistent printing accuracy.
  • Dust-Free Environment: HEPA assembly prevents dust and contamination, meeting class 100~1000 regulations, ideal for semiconductor applications.
  • Optional Add-Ons: Customizable with additional modules such as UV light, dropwatch, and CCD for enhanced functionality.
We are looking forward to your inquiry!

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