Cleaning, Developing, Etching, Stripping

Manz offers cleaning, developing, etching, and stripping processes in wet chemistry, primarily applied in the production of high-end semiconductor panel-level packaging (PLP), IC substrate, and display.

Flexible Applications, Superior Results

With nearly 40 years of experience in handling a variety of substrates in the photoresist process, our expertise ensures a high particle removal ratio, superior resolution, and thorough removal of remaining photoresist. This enables process flexibility across multiple applications.

 

Our equipment applies to the following fields:

 

  • Semiconductor FOPLP
  • Display
  • IC substrates & TGV (Through-glass via)

Our Capability

 

Semiconductor
FOPLP

 IC Substrate
Core		 IC Substrate
TGV		 Display
Material EMC FR-4 Glass Glass
L/S 2/2 40/40 um 2/2 um 2/2 um
Substrate size max. 700 x 700 mm 510 x 515 mm 510 x 515 mm max.
2940 x 3370 mm
(G10.5)

 

Your Benefits

 

  • High-precision gear configuration reduces vibration during transmission.
  • Drying section after blow-drying to prevent oxidation of the conductive layer.
  • High-uniformity spray plate configuration achieves small line width and spacing.
  • Horizontal and vertical automated loading and unloading system
We are looking forward to your inquiry!

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