High aspect ratio HDI PCBs are utilized in AI servers, 5G servers, base stations, and low-orbit satellites, where high transmission capacity and the ability to carry higher current densities are essential.
High aspect ratio HDI (High Density Interconnect) PCBs are increasingly integral to cutting-edge technologies, including AI servers, 5G servers, base stations, and low-orbit satellites.
These applications require high transmission capacity and the ability to handle higher current densities, making high aspect ratio PCBs crucial components in these advanced systems.
Our desmear and PTH (Plating Through Hole) equipment is specifically engineered to produce high aspect ratio PCBs. These PCBs feature small vias on thick boards, which are vital for enhancing signal transmission and heat dissipation.
As the demand for faster, more reliable data transmission and higher current density continues to rise, we remain at the forefront of PCB manufacturing technology, providing solutions that meet the rigorous requirements of today’s advanced electronics.
| Desmear & PTH | |
|---|---|
| Panel Size |
max. 610 x 610 mm, min. 250 x 250 mm |
| Thickness | 3.0–6.0 mm |
| Through hole | min. 0.2 mm |
| Aspect ratio | 30:1 |
