ELC 220 – Electronics Laser Cutting

The ELC 220 is a multi-axis laser cutting machine with fixed optics and a fiber laser for high-throughput applications with high accuracy. Laser drilling, marking or scribing are also possible. Unstrengthened glass, sapphire glass or ceramic substrates for use in consumer electronics can be processed.


The PLC controlled two-axis machine ELC 220 is able to cut up to 4 wafers and to load and unload up to 4 wafers in parallel. The wafers can be either round (2 inch diameter) or square (up to 55 mm x 55 mm) and up to 1 mm thick.
The forms to be cut are typically round and have a diameter of about 9.35 mm.
By changing part carriers and setup of the machine different work piece sizes of up to 1,100 mm x 1,400 mm can be processed.

  • Stand-alone system or line integration
  • Fixed optic setup
  • 1, 3x or 4x process heads for high throughput
  • Several laser sources available
  • Fully automatic handling (mass production) or semi-automatic handling (R&D) possible
  • MES interface
  • Integrated process metrology
  • Import of CAD files (e.g. DXF, DWG) possible
  • Vision system available

You can find further information in the download box on the right.


  • Cost savings through high-quality cutting edges (no downstream processes such as grinding necessary)
  • Higher breaking strength of the glass compared to conventional cutting, as edge roughness is very low, no heat-affected zone (HAZ) and almost no chipping and micro cracks
  • High throughput through highly dynamic process
  • Fast format change possible for small batches


Maximum product size with 4 laser heads:

Up to 4 material process chucks;
Substrate size 55 mm x 55 mm


<±20 µm absolute
<±10 µm repeatability

Fiber laser sources:

Wave length: 1,070 nm;
Pulse: ns

Beam delivery:

Fiber delivery; Fixed optics

Laser spot size:

10 - 300 µm




2,900 x 2,800 x 2,700 mm


5,000 - 5,500 kg

Power supply:

200 - 480 V

Compressed dry air:

6 -7 bar

Cooling Water:

5 - 20 l/min

Additional data available on request.

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