ELC 720 – Electronics Laser Cutting

The ELC 720 is a multi-axis laser machine that cuts by a short-pulse laser and separates by a CO2 laser transparent brittle material like sapphire wafers, glass wafers or ceramics with high edge quality, breaking strength, and throughput.


With up to two laser sources, the high-precision PLC controlled machine ELC 720 cuts discs (e.g. lenses) with a diameter of 5.5 mm out of wafers. The wafers are either round (2 inch diameter) or square (up to 55 mm x 55 mm) and are approximately 0.4 mm thick.

  • Stand-alone system or line integration
  • Up to 2x scanner heads
  • Up to 2x fixed optics
  • Linear or free forms
  • Fully automatic handling (mass production) or semi-automatic handling (R&D) possible
  • MES interface
  • Integrated process metrology
  • Vision system available
  • Import of CAD files (e.g. DXF, DWG) possible
  • Fully integrated exhaust system
  • You can find further information in the download box on the right.


  • Cost savings through high-quality cutting edges (no downstream processes such as grinding necessary)
  • Higher breaking strength of the glass compared to conventional cutting, as edge roughness is very low, no heat-affected zone (HAZ) and almost no chipping and micro cracks
  • High throughput through highly dynamic process
  • Fast format change possible for small batches


Working area:

Up to 4 material process chucks;
Scan field 60 mm x 60 mm


<±20 µm absolute
<±10 µm repeatability

Available laser sources:

Wave length:10.6 µm (CO2); 1,030 nm;
Pulse: µs; ps;

Beam delivery:

Scanner; Fixed optics

Laser spot size:

2 - 300 µm




2,900 x 2,800 x 2,700 mm


5,000 - 5,500 kg

Power supply:

200 - 480 V

Compressed dry air:

6 - 7 bar

Cooling water:

5 - 20 l/min

Additional data available on request.

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