PLC 440 – PCB Laser Cutting

The PLC 440 is an 8-axis machine with a short-pulse laser and 2 scanners for cutting and ablating ceramics ((Al2O3 (alumina), AlN (aluminum nitride) or Si3N4 (silicon nitride)) with high precision and high throughput.


The PLC controlled eight-axis machine PLC 440 scratches ceramic substrates with several available laser sources and generates predetermined breaking points for separation.

  • Stand-alone system or line integration
  • 2 scanners
  • Several laser sources available
  • Fully automatic handling (mass production) or semi-automatic handling (R&D) possible
  • MES interface
  • Integrated process metrology
  • Vision system available
  • Import of CAD files (e.g. DXF, DWG) possible
  • Fully integrated, high effective exhaust system

You can find further information in the download box on the right.


  • High quality scratch line (less material removal compared to CO2 process)
  • Greater packing density possible due to smaller scratch track width
  • Very small heat-affected zone (HAZ) as well as almost no chipping and micro cracks
  • High throughput through highly dynamic process
  • Fast format change possible for small batches


Working area:

Up to 4 material process chucks
Substrate size 55 mm x 55 mm


<±20 µm absolute
<±10 µm repeatability

Laser sources:

Pico laser

Beam delivery:


Laser spot size:

10 - 300 µm




2,900 x 2,800 x 2,700 mm


5,000 - 5,500 kg

Power supply:

200 - 480 V

Compressed dry air:

6 - 7 bar

Cooling water:

5 - 20 l/min

Additional data available on request. 

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