PSG Series – PCB Wet-Chemical Flash Plating
Our PCB flash plating solutions of the PSG Series are designed for pre-plating a layer of copper in blind vias. The integrated machines are well combinable with a plating through-hole process, dispose of a horizontal conveyor system and cover following process steps: loading and unloading, acid rinsing, copper plating, rinsing, and drying.
FEATURES
- Quick copper plating with high electric current density
- Insoluble titanium mesh anode
- Great covering power of blind holes ensures uniformity of copper plating thickness
- Equipped with automatic control system to guarantee stable process parameters
ADVANTAGES
- Excellent cathode clamping design to ensure high electroplating efficiency
- Excellent conveying structure design to avoid stacking or overlapping
- Excellent anode shape design to ensure uniformity of copper plating thickness
TECHNICAL DATA
Dimension: |
max. 610 x 610 mm |
Panel thickness: |
0.2 mm - 2.4 mm |
Bore diameter: |
Blind hole: min. 0.075 mm A/R 1:1 |
Additional data available on request.