PSG Series – PCB Wet-Chemical R2R Flash Plating

Our roll-to-roll (R2R) PCB flash plating solutions of the PSG Series are designed for pre-plating a layer of copper in blind vias. The integrated machines are well combinable with a plating through-hole process and cover following process steps: winding and unwinding, acid rinsing, copper plating, rinsing, and drying.


  • Quick copper plating with high electric current density
  • Insoluble titanium mesh anode
  • Great covering power of blind holes ensures uniformity of copper plating thickness
  • Equipped with automatic control system to guarantee stable process parameters


  • Modularized design: tension or dancer rollers can be selected according to the process requirements to prevent deforming
  • Robust body structure to maintain parallel position of rollers during long-term operation
  • Superior Edge Position Control (EPC) to ensure even and straight rolling
  • Excellent cathode clamping design to ensure high electroplating efficiency


Specifications of substrates:

Panel width

250 – 600 mm (can be customized for different sizes)

Panel thickness

12.5 μm – 25 μm or thicker

Dia. of blind hole

min. 0.075 mm A/R 1:1

R2R performance:

Normal operating time (uptime)

≥ 95 %

Mean repair time (MTTR)

4 h

EPC permissible edge alignment

± 0.5 mm

Low-tension control

5 N – 30 N

Additional data available on request.

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