PSG Series – PCB Wet-Chemical R2R Flash Plating
Our roll-to-roll (R2R) PCB flash plating solutions of the PSG Series are designed for pre-plating a layer of copper in blind vias. The integrated machines are well combinable with a plating through-hole process and cover following process steps: winding and unwinding, acid rinsing, copper plating, rinsing, and drying.
FEATURES
- Quick copper plating with high electric current density
- Insoluble titanium mesh anode
- Great covering power of blind holes ensures uniformity of copper plating thickness
- Equipped with automatic control system to guarantee stable process parameters
ADVANTAGES
- Modularized design: tension or dancer rollers can be selected according to the process requirements to prevent deforming
- Robust body structure to maintain parallel position of rollers during long-term operation
- Superior Edge Position Control (EPC) to ensure even and straight rolling
- Excellent cathode clamping design to ensure high electroplating efficiency
TECHNICAL DATA
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Specifications of substrates: |
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Panel width |
250 – 600 mm (can be customized for different sizes) |
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Panel thickness |
12.5 μm – 25 μm or thicker |
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Dia. of blind hole |
min. 0.075 mm A/R 1:1 |
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R2R performance: |
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Normal operating time (uptime) |
≥ 95 % |
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Mean repair time (MTTR) |
4 h |
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EPC permissible edge alignment |
± 0.5 mm |
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Low-tension control |
5 N – 30 N |
Additional data available on request.