PWP Series – PCB Wet-Chemical Shadow Process

Equipment of the PWP Series for the shadow process (direct metallization) deposits conductive graphite colloid on the hole walls as basis for electrolytic copper plating. The integrated production line is well combinable with desmear process, disposes of a horizontal conveyor system and comprises following process steps: loading and unloading, cleaning/conditioning, graphite colloid deposition, fixing, micro-etching as well as multiple rinsing and drying steps.


  • Very good process results for through-holes and blind holes
  • No dirt or residual chemicals after wet cleaning
  • High conveying stability with deviation of only ± 10 mm (with width control device)
  • Equipped with automatic control system to guarantee stable process parameters


  • Over 95 % modularized products
  • Excellent squeeze roller design with drag-out of ≤ 10 cc/m² to prevent chemical drag-out and contamination
  • Sloped-bottom tanks for chemical processes to minimize solution leftover
  • Sloped-bottom and small-volume tanks for rinsing process to improve tank turnover rate by 50 %



max. 610 x 610 mm
min. 250 x 250 mm

Panel thickness:

0.1 mm - 3.2 mm traditional PCB
0.8 mm - 12mm backboard

Bore diameter:

Through hole: min. 0.1 mm A/R 10:1
Blind hole: min. 0.075 mm A/R 1:1

Additional data available on request.

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