Products

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PAH Series – PCB Automated Handling

PAH Series – PCB Automated Handling

Handling solutions of the PAH Series transfer panels from process platforms to vertical conveying systems and back. The PAH Series include handling systems for loading and unloading for vertical developing, vertical etching, vertical stripping, vertical electroplating and other processes in PCB production.

PLC 440 – PCB Laser Cutting

PLC 440 – PCB Laser Cutting

The PLC 440 is an 8-axis machine with a short-pulse laser and 2 scanners for cutting and ablating ceramics ((Al2O3 (alumina), AlN (aluminum nitride) or Si3N4 (silicon nitride)) with high precision and high throughput.

PLI 400 SpeedLight – PCB Laser Direct Imaging

PLI 400 SpeedLight – PCB Laser Direct Imaging

The laser direct imaging (LDI) system PLI 400 SpeedLight is the flexible solution for efficiently producing high-resolution premium printed circuit boards (PCB). Thanks to the use of Manz LDI technology, you can fulfill the most demanding customer requests for circuit board production and lower your production costs by up to 75 % in comparison to conventional photolithography.

PSG SERIES – Computer-Integrated Manufacturing (CIM) Systems

PSG SERIES – Computer-Integrated Manufacturing (CIM) Systems

Manz Computer-Integrated Manufacturing (CIM) Systems for the PCB production focus on the integration between process units. Each independent equipment ,upstream and downstream, can be integrated into an automated production line in accordance with customer’s requirements. Manz has developed a series of CIM products for automated factories, automated equipment management, equipment monitoring systems, and on-site data collection.

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PSG Series – PCB Inline Analysis and Dosing System

PSG Series – PCB Inline Analysis and Dosing System

The fully automatic Inline Chemistry Analyzer ICA of the PSG Series enables a real-time analysis and subsequent dosing of up to five chemicals for consistently high production results in wet-chemical processes of PCB production.

PSG Series – PCB Wet-Chemical Flash Plating

PSG Series – PCB Wet-Chemical Flash Plating

Our PCB flash plating solutions of the PSG Series are designed for pre-plating a layer of copper in blind vias. The integrated machines are well combinable with a plating through-hole process, dispose of a horizontal conveyor system and cover following process steps: loading and unloading, acid rinsing, copper plating, rinsing, and drying.

PSG Series – PCB Wet-Chemical R2R Flash Plating

PSG Series – PCB Wet-Chemical R2R Flash Plating

Our roll-to-roll (R2R) PCB flash plating solutions of the PSG Series are designed for pre-plating a layer of copper in blind vias. The integrated machines are well combinable with a plating through-hole process and cover following process steps: winding and unwinding, acid rinsing, copper plating, rinsing, and drying.

PWD Series – PCB Wet-Chemical Horizontal Developing

PWD Series – PCB Wet-Chemical Horizontal Developing

Developers of the PWD Series completely remove dry films, wet films or ink which have not been exposed. Our developers for the production of PCBs are matched with stripping and etching processes, dispose of a horizontal conveyor system and comprise following process steps: loading and unloading, developing, (descum) rinsing and drying.

PWD Series – PCB Wet-Chemical R2R Developing

PWD Series – PCB Wet-Chemical R2R Developing

Roll-to-roll (R2R) developers of the PWD Series completely remove dry films, wet films or ink which have not been exposed. Our R2R-developers for the production of FPCs are matched with stripping and etching processes and comprise following process steps: winding and unwinding, developing, (descum) rinsing and drying.

PWD Series – PCB Wet-Chemical Vertical Developing

PWD Series – PCB Wet-Chemical Vertical Developing

Developers of the PWD Series completely remove dry films, wet films or ink which have not been exposed. Our developers for the production of PCBs are matched with stripping and etching processes, dispose of a vertical conveyor system and comprise following process steps: loading and unloading, developing, (descum) rinsing and drying.

Markets

Technologies

PWE Series – PCB Wet-Chemical Horizontal Etching

PWE Series – PCB Wet-Chemical Horizontal Etching

Etching equipment of the PWE Series comprises copper etching, rinsing and drying processes with horizontal conveyors. All machines of the PWE Series are matched with developing and stripping processes such as film or tin stripping.

PWE Series – PCB Wet-Chemical R2R Etching

PWE Series – PCB Wet-Chemical R2R Etching

Roll-to-roll (R2R) etching equipment of the PWE Series comprises copper etching, rinsing and drying processes in the production of FPCs. All machines of the PWE Series are matched with developing and stripping processes such as film or tin stripping.

PWE Series – PCB Wet-Chemical Vertical Etching

PWE Series – PCB Wet-Chemical Vertical Etching

Etching equipment of the PWE Series comprises copper etching, rinsing and drying processes with vertical conveyors. All machines of the PWE Series are matched with developing and stripping processes such as film or tin stripping.

PWM Series – PCB Wet-Chemical Desmear

PWM Series – PCB Wet-Chemical Desmear

Desmear machines of the PWM Series completely remove smear in the holes resulting from drilling and roughening. Our desmear equipment disposes of a horizontal conveyor system and comprises following process steps: loading and unloading, swelling, rinsing, desmear, pre-neutralizing and neutralizing, as well as drying. The PWM Series is well combinable with plating through-hole processes.

PWM Series – PCB Wet-Chemical R2R Desmear

PWM Series – PCB Wet-Chemical R2R Desmear

Roll-to-Roll (2R) desmear machines of the PWM Series completely remove smear in the holes resulting from drilling and roughening. Our desmear equipment comprises following process steps: winding and unwinding, swelling, rinsing, desmear, pre-neutralizing and neutralizing, as well as drying. The PWM Series is well combinable with plating through-hole processes.

PWN Series – PCB Wet-Chemical Silver Immersion Process

PWN Series – PCB Wet-Chemical Silver Immersion Process

Equipment of the PWN Series enhance the solderability by depositing a silver layer on the area where the components are bonded. The integrated production line disposes of a horizontal conveyor system and comprises following process steps: loading and unloading, cleaning, rinsing, micro-etching, pre-dip, immersion silver, drying.

Markets

Technologies

PWN Series – PCB Wet-Chemical Tin Immersion Process

PWN Series – PCB Wet-Chemical Tin Immersion Process

Machines of the PWN Series enhance the solderability by depositing a tin layer on the area where the components are bonded. The integrated production line disposes of a horizontal conveyor system and comprises following process steps: loading and unloading, cleaning, rinsing, micro-etching, pre-dip, immersion tin, drying.

Markets

Technologies

PWO Series – PCB Wet-Chemical Oxide Replacement Process

PWO Series – PCB Wet-Chemical Oxide Replacement Process

Equipment of the PWO Series form a tear resistant oxidization layer on the inner layer to enhance the bonding of the inner layer and prepreg during the lamination process. The integrated production line for the manufacture of multi-layer PCBs disposes of a horizontal conveyor system and comprises following process steps: loading and unloading, several rinsing processes including acid and alkaline rinsing, oxide replacement, drying.

Markets

Technologies

PWP Series – PCB Wet-Chemical Black-Hole Process

PWP Series – PCB Wet-Chemical Black-Hole Process

Equipment of the PWP Series for the black-hole process (direct metallization) deposits conductive carbon on the hole walls as basis for electrolytic copper plating. Our integrated black-hole machines are well combinable with desmear process, dispose of a horizontal conveyor system and cover following process steps: loading and unloading, cleaning/conditioning, multiple rinsing and drying steps, black-hole process as well as micro-etching.

PWP Series – PCB Wet-Chemical Electroless Copper Deposition

PWP Series – PCB Wet-Chemical Electroless Copper Deposition

Equipment of the PWP Series guarantees an optimum deposition of electroless copper on the hole walls as basis for electrolytic copper plating. The integrated production line is well combinable with desmear process, disposes of a horizontal conveyor system and covers following process steps: loading and unloading, conditioning, micro-etching, pre-dip, activation, reduction, copper deposition as well as several rinsing and drying steps.

PWP Series – PCB Wet-Chemical R2R Black-Hole Process

PWP Series – PCB Wet-Chemical R2R Black-Hole Process

Roll-to-Roll (R2R) Equipment of the PWP Series for the black-hole process (direct metallization) deposits conductive carbon on the hole walls as basis for electrolytic copper plating. Our integrated black-hole lines are well combinable with desmear process and cover following process steps: winding and unwinding, cleaning/conditioning, multiple rinsing and drying steps, black-hole process as well as micro-etching.

PWP Series – PCB Wet-Chemical R2R Electroless Copper Deposition

PWP Series – PCB Wet-Chemical R2R Electroless Copper Deposition

Roll-to-Roll (R2R) equipment of the PWP Series guarantees an optimum deposition of electroless copper on the hole walls as basis for electrolytic copper plating. The integrated production line is well combinable with desmear process and covers following process steps: winding and unwinding, conditioning, micro-etching, pre-dip, activation, reduction, copper deposition as well as several rinsing and drying steps.

PWP Series – PCB Wet-Chemical R2R Shadow Process

PWP Series – PCB Wet-Chemical R2R Shadow Process

Roll-to-Roll (R2R) equipment of the PWP Series for the shadow process (direct metallization) deposits conductive graphite colloid on the hole walls as basis for electrolytic copper plating. The integrated production line is well combinable with desmear process and comprises following process steps: winding and unwinding, cleaning/conditioning, graphite colloid deposition, fixing, micro-etching as well as multiple rinsing and drying steps.

PWP Series – PCB Wet-Chemical Shadow Process

PWP Series – PCB Wet-Chemical Shadow Process

Equipment of the PWP Series for the shadow process (direct metallization) deposits conductive graphite colloid on the hole walls as basis for electrolytic copper plating. The integrated production line is well combinable with desmear process, disposes of a horizontal conveyor system and comprises following process steps: loading and unloading, cleaning/conditioning, graphite colloid deposition, fixing, micro-etching as well as multiple rinsing and drying steps.

PWS Series – PCB Wet-Chemical Horizontal Stripping

PWS Series – PCB Wet-Chemical Horizontal Stripping

Strippers of the PWS Series remove the remaining dry or wet film photoresist on the circuits. Our strippers are matched with developing, etching and tin stripping processes, dispose of a horizontal conveyor system and comprise following process steps: loading and unloading, stripping, water and acid rinsing as well as drying.

PWS Series – PCB Wet-Chemical R2R Stripping

PWS Series – PCB Wet-Chemical R2R Stripping

Roll-to-roll (R2R) strippers of the PWS Series remove the remaining dry or wet film photoresist on the circuits. Our strippers are matched with developing, etching and tin stripping processes and comprise following process steps: unwinding and winding, stripping, water and acid rinsing as well as drying.

PWS Series – PCB Wet-Chemical Vertical Stripping

PWS Series – PCB Wet-Chemical Vertical Stripping

Strippers of the PWS Series remove the remaining dry or wet film photoresist on the circuits. Our strippers are matched with developing, etching and tin stripping processes, dispose of a vertical conveyor system and comprise following process steps: loading and unloading, stripping, water and acid rinsing as well as drying.

PWT Series – PCB Wet-Chemical R2R Surface Treatment

PWT Series – PCB Wet-Chemical R2R Surface Treatment

Roll-to-roll (R2R) machines of the PWT Series are used for cleaning and roughening the copper surface to improve its bonding ability for following processes. The PWT Series combines following process steps in the production of FPCs: winding and unwinding, cleaning, water and acid rinsing, micro-etching as well as drying.

PWT Series – PCB Wet-Chemical Surface Treatment

PWT Series – PCB Wet-Chemical Surface Treatment

Equipment of the PWT Series is used for cleaning and roughening the copper surface to improve its bonding ability for following processes. The PWT Series combines horizontal processes and covers loading and unloading, brushing/cleaning, water and acid rinsing, micro-etching as well as drying.