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ELC 220 – Electronics Laser Cutting
The ELC 220 is a multi-axis laser cutting machine with fixed optics and a fiber laser for high-throughput applications with high accuracy. Laser drilling, marking or scribing are also possible. Unstrengthened glass, sapphire glass or ceramic substrates for use in consumer electronics can be processed.
ELC 420 – Electronics Laser Cutting
The ELC 420 is a multi-axis laser machine with 4 process heads for high-throughput applications. It cuts and ablates material (preferably sapphire, glass or ceramics) by a short-pulse laser. The machine is designed in particular for highly precise processing.
ELC 720 – Electronics Laser Cutting
The ELC 720 is a multi-axis laser machine that cuts by a short-pulse laser and separates by a CO2 laser transparent brittle material like sapphire wafers, glass wafers or ceramics with high edge quality, breaking strength, and throughput.
LightAssembly – Assembly-driven Production Solutions
The modular and freely configurable assembly platform LightAssembly offers a reliable automation and integration of complex assembly processes. From incoming goods inspection to assembly and quality control all the way to packaging, the assembly line can be individually configured and scaled according to the modular principle.
PLI 400 SpeedLight – PCB Laser Direct Imaging
The laser direct imaging (LDI) system PLI 400 SpeedLight is the flexible solution for efficiently producing high-resolution premium printed circuit boards (PCB). Thanks to the use of Manz LDI technology, you can fulfill the most demanding customer requests for circuit board production and lower your production costs by up to 75 % in comparison to conventional photolithography.