We are your premier partner, providing redistribution layer (RDL) metallization process tools, tailored for glass substrates in the semiconductor industry: Through-glass via (TGV) process solutions.
Glass forming processes enable the production in panel format and various thicknesses, providing an effective method for manufacturing low electrical loss materials, particularly at high frequencies. The high stiffness and adjustable coefficient of thermal expansion of glass are advantageous for managing warp in glass core substrates and bonded stacks, which are essential for through-glass vias (TGV) and carrier applications.
The industry's increasing adoption of glass solutions has led to significant advancements in downstream processes such as glass handling and via / surface metallization. Utilizing tool sets and processes for panel fabrication allows for achieving desired cost structures within the industry.
With nearly four decades of experience in glass handling and metallization processes, we are the trusted partner for developing handling techniques and process equipment to enhance process flow.
We offer highly selective TGV and RDL construction process equipment, ensuring the maintenance of high-quality processes. Our adjustable solutions are tailored to meet customers' specific requirements.
| Through-glass Via (TGV) | Redistribution Layer (RDL) |
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Aspect ratio from 1:5, with future potential up to 1:20 |
5μm - 20μm copper thickness |
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Round holes exceeding 100μm |
1 - 2 metal layers |
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Accommodating 400μm glass thickness in panel formats of 510 x 515 mm, 600 x 600 mm, and 620 x 750 mm |
10μm - 20μm die electrics thickness |
| Lower taper angles |
Contact us to learn more about our superior glass core packaging solutions expertise and see the difference we can make for your business.
