With our advanced technologies and innovative panel-level packaging, we increase throughput and streamline processes, optimizing equipment utilization to scale production and drive productivity growth.
At Manz, we empower semiconductor innovation with our leading Panel-Level Redistribution Layer (RDL) production equipment and solutions. We have a strong expertise in advanced interconnect applications, providing both stand-alone tools and integrated solutions for high-density redistribution layers in panel-level packaging. Our Total Fab Services incorporate cutting-edge software systems to ensure efficient workflow, giving customers a competitive edge in future chip manufacturing.
By processing multiple chips on a single large panel, we significantly boost manufacturing throughput.
Utilizing larger substrates reduces material costs and enhances overall production efficiency, making it a highly cost-effective solution.
Our technology ensures precise placement and processing of RDL layers, resulting in high-quality, reliable semiconductor products.
We ensure scalability by modular production lines that can be easily expanded. Our production lines can be configured to add more processing units as demand increases, allowing for incremental scaling without significant overhauls.
Our expertise in FOPLP, Through Glass Via (TGV), and Inkjet Printing positions us at the forefront of the industry.
Manz can revolutionize your semiconductor manufacturing process, bringing innovative products to market.
The possibilities are endless. Contact us today to learn more about our Panel-Level RDL technology and explore the business opportunities.
