Inkjet Applications for Semiconductor IC Packaging

With our newly developed inkjet printing equipment we increase the production flexibility and environmental friendliness.

Inkjet Printing of Functional Materials

Inkjet printing of functional materials offers a promising alternative to traditional methods in low-cost, large-area electronics. This maskless process reduces material waste and allows for easy modifications via computer-aided design, aligning with ESG goals by eliminating the need for expensive lithography, high power demand processes, and toxic waste treatment.

Our digital inkjet printing enables three-dimensional printing of functional materials, including metal structures formed without exceeding bulk metal melting points. Leveraging our expertise in TGV metallization and RDL construction for semiconductor packaging, all steps, from processing to characterization, are performed at low temperatures and in an ambient environment.

Key Benefits
 

  • Versatile Functional Printing: Ideal for customization applications
  • Precision: Ensures accurate dot and space definition in the X/Y direction with drop accuracy within +/-5um
  • High-Speed Printing: Multiple printheads with interlaced nozzles offer higher resolution and throughput
  • User-Friendly Interface: Our GUI simplifies the complex application process for customers

Our flexible system supports a wide range of ink types and ensures unmatched adhesion, facilitating easy, scalable manufacturing processes that are simple to manage.

Why Manz?

  • Industry leader since 1986: Manz has been a trusted partner to top manufacturers in the display, IC substrate, and advanced packaging industries for decades, boasting over 8,000 equipment installations worldwide.
  • Proven mass production solutions: Our solutions are designed to ensure efficient mass production, meeting the high demands of modern manufacturing.
  • Integrated manufacturing: We offer highly efficient manufacturing solutions by combining automation, wet chemistry, electroplating, and inkjet printing, all integrated into our processes.
  • Comprehensive services: Manz provides end-to-end support, from equipment provision to production fab planning, ensuring a seamless manufacturing experience for our clients.
  • Expansion into the semiconductor industry: We are actively expanding into the semiconductor sector, facilitating seamless business transfers and market penetration, bringing our expertise to a new frontier.

Explore how Manz’s advanced inkjet printing technology can enhance your semiconductor IC packaging production. Contact us today to learn more.

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