Highly efficient equipment for modern electronic connection systems and through-glass vias (TGV)
The base material of IC packages is the integrated circuit substrate. They shield the bare IC while supporting interconnection between the IC and the PCB's trace network. The IC substrate, featuring a network of drilled holes and conductor pads, serves as an electrical interconnection for one or more devices, providing a pathway for the device to communicate with the rest of the system. It acts as an intermediate product that secures a semiconductor IC chip and installs internal wiring to connect the chip to the PCB.
IC substrates are diverse, and Manz specializes in offering production solutions, particularly for Flip-Chip IC substrates. With high-efficiency and stable equipment, we have earned the trust and confidence of our customers.
We offer extensive wet chemistry solutions, including pre-treatment, developing, etching, stripping, brown oxide, DSM/PTH (Desmear/Plated Through Hole), imaging, surface treatments, and automation handling systems.
Glass forming processes enable production in panel format and various thicknesses, providing an additional method for manufacturing with low electrical loss, especially at high frequencies. Its high stiffness and adjustable coefficient of thermal expansion are beneficial for managing warp in glass core substrates and bonded stacks used for through-glass vias (TGV) and carrier applications.
The industry's increasing adoption of glass solutions has led to significant advancements in downstream processes, such as glass handling and via/surface metallization. Leveraging tool sets and processes for panel fabrication allows the achievement of desired cost structures within the industry.
With nearly four decades of experience in glass handling and metallization processes, Manz is the trusted partner for collaborating on handling techniques and developing process equipment to improve process flow.
Manz provides highly selective TGV and RDL construction process equipment, ensuring the maintenance of high-quality processes. Our adjustable solutions are tailored to meet customers' specific requirements. Our equipment lineup includes: glass substrate cleaners, laser treatment, glass etching, via cleaners, through-hole plating (PTH), inkjet printing, and double-sided plating.
Focusing on critical processes of IC substrates, our equipment meets the criteria of manufacturers for modern electronics.
