High Efficiency Equipment of Modern Electronic Interconnect Systems and Through Glass Vias (TGV)
Manz offerings are not only providing wet chemistry processes or stand-alone machinery but also delivering one-stop solutions to drive production efficiency and superb quality by linking the production with software and integrated hardware expertise.
Glass core substrates offer cost advantages and excellent heat dissipation, effectively improving the performance of end products.
The unique properties of the glass interlayer — low electrical loss at high frequencies — make it an ideal choice for the manufacture of radio frequency integrated circuits (RFIC), resulting in superior performance and efficiency.
Manz Through Glass Via (TGV) solution
Cleaning｜Laser processing｜Etching｜PTH｜Plating
Manz offers wet chemistry solutions for pre-treatment, developing, etching, stripping, brown oxide, DSM/PTH, imaging, various surface treatment and automation. With maximized efficiency and stability of equipment, Manz has gained customer trust and confidence.
The strengths of our one stop solution:
Focusing on critical processes of IC substrates, our equipment meets the criteria of manufacturers for modern electronics.
