With our highly efficient systems, we can realize state-of-the-art electronic connection systems and through-glass via (TGV) applications and take our customers' production to a new level.
An IC substrate (Integrated Circuit Substrate) is an important component in semiconductor technology and forms the basis for the physical and electrical support of integrated circuits (ICs). The substrate is the base or carrier material and is located inside the IC housing.
The substrates shield the bare IC and at the same time support the connection between the IC and the PCB trace network. The IC substrate, which consists of a network of holes and traces, serves as an electrical connection for one or more components and provides a path for the component to communicate with the rest of the system. It acts as an intermediate product that secures a semiconductor IC chip and installs the internal wiring to connect the chip to the PCB.
Given the diverse range of IC substrates, flexible and customized production solutions are essential. At Manz, we excel in providing these solutions, with a special focus on flip-chip IC substrates.
Numerous customers from the electronics and semiconductor industries have been relying on our highly efficient and stable systems for years.
Glass forming processes enable production in panel format and various thicknesses, providing an additional method for manufacturing with low electrical loss, especially at high frequencies. The high stiffness and adjustable coefficient of thermal expansion offer advantages in controlling the deformation of glass core substrates and bonded stacks used for numerous carrier applications such as through-glass vias (TGV).
The increasing use of glass solutions in the industry has led to significant advances in downstream processes such as glass handling and metallization of vias/surfaces. The use of tool sets and processes for panel manufacturing enables the desired cost structures to be achieved in the industry.
With almost four decades of experience in glass handling and metallization, we are your reliable partner for the application of handling techniques and the development of suitable equipment to improve the process flow.
We offer highly selective equipment for the TGV and RDL build-up process, ensuring the maintenance of high-quality processes. Our flexible and scalable solutions are optimized to meet the specific requirements of our customers.
Focusing on critical processes of IC substrates, our equipment meets the criteria of manufacturers for modern electronics.
