The Key Technology to Achieve Semiconductor High-density Packaging
Moving to high portability and multi-functionality for electronics, also with AIoT, 5G, and smart vehicles, the ICs are required compact, better performance & cost-effective. This led to a boom in advanced packaging technologies.
The rising demand of modern electronics is boosting the technology of homogeneous or heterogeneous integration. Leveraging the RDL process, the latest multi-chip packaging trends are shifting from PCB or IC substrate to advanced integration technologies such as thin film process or 2.5D silicon interposer.
We are leading in automation, wet chemistry, electroplating and inkjet printing for RDL production technologies. This enables us to offer customized and highly efficient integrated manufacturing solutions.
FOPLP fulfills the requirements for high electrical conductivity, functionality and improved heat dissipation of silicon chips.
Compared to FOWLP implementation in CPU or GPU packaging, FOPLP is preferred for cost-efficient packaging of high performance, high power and low power semiconductor devices and applications. It is suitable for the production of APE, power ICs and power management chips.
The new vertical electroplating without using a jig, which can save the purchase cost of the jig, as well as the consumption of electroplating solution and the cost of cleaning solution during the process.
Furthermore, the electroplating equipment adopts a modular design, which can be flexibly configured according to the customer's production capacity and plant area. The components can be quickly operated and disassembled, easy to maintain and can help customers to carry out efficient production.
Manz FOPLP RDL production solutions with proven records for mass manufacture the panel of 510mm x 515mm, 600mm x 600mm, 700mm x 700mm.
