The Key Technology to Achieve Semiconductor High-density Packaging
Advanced Packaging Technologies to Drive Innovation
Driven by the rapid growth of high-end AI servers and advancements in generative AI technologies, the semiconductor industry is set to create significant opportunities for multi-chip integration with high compute GPUs, SoC designs, and HBM. This approach increases I/O densities and the physical dimensions of modern chips, such as AI GPUs, leading to challenges for conventional wafer-level packaging due to capacity shortages. As a result, Chip-on-Panel-on-Substrate (CoPoS) boosts system integration through panel-level packaging.
「CoPoS」Chip-on-Panel-on-Substrate increases production capacity
Manz solutions utilize rectangular panel-like substrates instead of traditional round wafers. Materials include glass, organic, and stainless steel, offering process areas from 510 mm x 515 mm to 700 mm x 700 mm, which is currently the largest industrial dimension, with production capacity equivalent to approximately eight times that of 12-inch wafers. The CoPoS concept offers high manufacturing flexibility, enhanced production efficiency, and the ability to accommodate more stacked chips within a single IC package
RDL Process is an Integral Part of FOPLP
The rising demand of modern electronics is boosting the technology of homogeneous or heterogeneous integration. Leveraging the RDL process, the latest multi-chip packaging trends are shifting from PCB or IC substrate to advanced integration technologies such as thin film process or 2.5D silicon interposer.
Panel Level Packaging RDL solutions targeting both Chip-First and Chip-Last packaging technique
Manz leverages its expertise to provide tailored RDL solutions for various metal layer interconnect structures and packaging forms. This approach targets chip products, including power management ICs, Radio Frequency ICs, smaller ICs using the Chip-First process, and AI chips fabricated through the Chip-Last packaging technique.
We are leading in automation, wet chemistry, electroplating and inkjet printing for RDL production technologies. This enables us to offer customized and highly efficient integrated manufacturing solutions.
The new vertical electroplating without using a jig, which can save the purchase cost of the jig, as well as the consumption of electroplating solution and the cost of cleaning solution during the process.
Furthermore, the electroplating equipment adopts a modular design, which can be flexibly configured according to the customer's production capacity and plant area. The components can be quickly operated and disassembled, easy to maintain and can help customers to carry out efficient production.
Chip-on-Panel-on-Substrate (CoPoS) boots system integration through panel-level packaging
