PWE Series – PCB Wet-Chemical Horizontal Etching

Etching equipment of the PWE Series comprises copper etching, rinsing and drying processes with horizontal conveyors. All machines of the PWE Series are matched with developing and stripping processes such as film or tin stripping.


  • Particularly suitable for fine-line circuits due to etching factor of ≥ 3.5
  • Due to current collecting device, improved water-pool effect and high etching uniformity of up to 95 %
  • High conveying stability with deviation of only ± 10 mm
  • Equipped with automatic control systems to ensure longest uptime


  • Over 95 % modularized products prevent scratches on dry film and circuits
  • No pre-etching and compensating etching processes needed, thus flow process is shortened and production costs are reduced effectively
  • Sloped-bottom and small-volume tank for rinsing processes to improve tank turnover rate by 50 %



max. 610 x 610 mm
min. 250 x 250 mm

Panel thickness:

0.05 mm (core)+Cu up to 3.2 mm traditional PCB
0.8 mm – 12 mm backboard

Bore diameter:

Through hole: min. 0.1 mm A/R 10:1
Blind hole: min. 0.075 mm A/R 1:1

Etching capability:

30/30 μm for 12 μm Cu
40/40 μm for 18 μm Cu


Additional data available on request.

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