PWN Series – PCB Wet-Chemical Silver Immersion Process
Equipment of the PWN Series enhance the solderability by depositing a silver layer on the area where the components are bonded. The integrated production line disposes of a horizontal conveyor system and comprises following process steps: loading and unloading, cleaning, rinsing, micro-etching, pre-dip, immersion silver, drying.
FEATURES
- Uniform immersion silver layer, no color difference, no roller marks, water marks or scratches
- Completely eliminated whisker risk
- No dirt or residual chemicals after wet-cleaning
- High conveying stability with deviation of only ± 10 mm (with width control device)
- Equipped with automatic control system to guarantee stable process parameters
ADVANTAGES
- Over 95 % modularized products
- Excellent squeeze roller design with drag-out of ≤ 10 cc/m² to prevent chemical drag-out and contamination
- Sloped-bottom tanks for chemical processes to minimize solution leftover
- Sloped-bottom and small-volume tanks for rinsing process to improve tank turnover rate by 50 %
TECHNICAL DATA
Dimension: |
max. 610 x 610 mm |
Panel thickness: |
0.1 mm - 3.2 mm traditional PCB |
Bore diameter: |
Through-hole: min. 0.1 mm A/R 10:1 |
Additional data available on request.