PWN Series – PCB Wet-Chemical Silver Immersion Process

Equipment of the PWN Series enhance the solderability by depositing a silver layer on the area where the components are bonded. The integrated production line disposes of a horizontal conveyor system and comprises following process steps: loading and unloading, cleaning, rinsing, micro-etching, pre-dip, immersion silver, drying.


  • Uniform immersion silver layer, no color difference, no roller marks, water marks or scratches
  • Completely eliminated whisker risk
  • No dirt or residual chemicals after wet-cleaning
  • High conveying stability with deviation of only ± 10 mm (with width control device)
  • Equipped with automatic control system to guarantee stable process parameters


  • Over 95 % modularized products
  • Excellent squeeze roller design with drag-out of ≤ 10 cc/m² to prevent chemical drag-out and contamination
  • Sloped-bottom tanks for chemical processes to minimize solution leftover
  • Sloped-bottom and small-volume tanks for rinsing process to improve tank turnover rate by 50 %



max. 610 x 610 mm
min. 250 x 250 mm

Panel thickness:

0.1 mm - 3.2 mm traditional PCB
0.8 mm - 12 mm backboard

Bore diameter:

Through-hole: min. 0.1 mm A/R 10:1
Blind hole: min. 0.075 mm A/R 1:1

Additional data available on request.

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