PWP Series – PCB Wet-Chemical R2R Electroless Copper Deposition

Roll-to-Roll (R2R) equipment of the PWP Series guarantees an optimum deposition of electroless copper on the hole walls as basis for electrolytic copper plating. The integrated production line is well combinable with desmear process and covers following process steps: winding and unwinding, conditioning, micro-etching, pre-dip, activation, reduction, copper deposition as well as several rinsing and drying steps.


  • Very good process results for through-holes and blind holes
  • No dirt or residual chemicals after wet cleaning
  • High conveying stability with deviation of only ± 10 mm (with width control device)
  • Equipped with automatic control system to guarantee stable process parameters
  • Single-track or double-track conveyor can be selected according to production capacity and process requirements


  • Modularized design: tension or dancer rollers can be selected according to the process requirements to prevent deforming
  • Robust body structure to maintain parallel position of rollers during long-term operation
  • Superior Edge Position Control (EPC) to ensure even and straight rolling
  • Sloped-bottom tanks for chemical processes to minimize solution leftover
  • Sloped-bottom and small-volume tanks for rinsing process to improve tank turnover rate by 50 %


Panel width

250 – 600 mm (can be customized for different sizes)

Panel thickness

12.5 μm - 25 μm or thicker

Dia. of through hole

min. 0.1 mm A/R 10:1

Dia. of blind hole

min. 0.075 mm A/R 1:1

Normal operating time (uptime)

≥ 95 %

Mean repair time (MTTR)

4 h

EPC permissible edge alignment

± 0.5 mm

Low-tension control

5 N - 30 N

Additional data available on request.

Back to overview