Driven by AI and HPC, advanced packaging technologies are undergoing a transformation with smaller I/O pitches and higher-density RDL line spacing.
Manz offers a comprehensive suite of technologies, including wet chemistry, plating, automation, inkjet printing, inspection, and laser solutions for producing fine-line RDL. These solutions are versatile, catering to various applications such as TGV, FOPLP, IC substrate, and HAR PCB.
Glass core substrates offer cost advantages and excellent heat dissipation, effectively enhancing the performance of end products.
The unique properties of the glass intermediate layer—achieving low electrical loss at high frequencies—make it an ideal choice for manufacturing Radio Frequency Integrated Circuits (RFIC), resulting in superior performance and efficiency
Manz through glass via (TGV) solution
Cleaning｜Laser processing｜Etching｜PTH｜Plating
With advantages of high integration density, low cost and high reliability, FOPLP has been
adopted for power management ICs in automotive applications, and continues to drive
adoption in support of next generation radio frequency ICs for LEO satellites.
Manz provides re-distribution layers (RDL) technology and solutions to offer customers high density, high volume and low production cost manufacturing lines.
Manz FOPLP RDL Production Solutions
